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Hall IC Series
Omnipolar Detection Hall ICs
BU52001GUL, BU52011HFV, BU52021HFV, BU52015GUL, BU52025G, BU52051NVX, BD7411G
No.10045ECT02
Description The bipolar Hall ICs are magnetic switches that can operate both S-and N-pole , upon which the output goes from Hi to Low. In addition to regular single-output Hall ICs, We offers a line up of dual-output units with a reverse output terminal (active High). Features 1) Omnipolar detection 2) Micropower operation (small current using intermittent operation method)(BD7411G is excluded.) 3) Ultra-compact CSP package (BU52001GUL,BU52015GUL) 4) Ultra-Small outline package HVSOF5 (BU52011HFV,BU52021HFV) 5) Ultra-Small outline package SSON004X1216 (BU52051NVXV) 6) Small outline package (BU52025G,BD7411G) 7) Line up of supply voltage For 1.8V Power supply voltage(BU52011HFV,BU52015GUL,BU52051NVX) For 3.0V Power supply voltage (BU52001GUL) For 3.3V Power supply voltage (BU52021HFV,BU52025G) For 5.0V Power supply voltage (BD7411G) 8) Dual output type (BU52015GUL) 9) High ESD resistance 8kV(HBM) Applications Mobile phones, notebook computers, digital video camera, digital still camera, white goods etc. Product Lineup Product name BU52001GUL BU52015GUL BU52051NVX BU52011HFV BU52021HFV BU52025G BD7411G Supply voltage (V) 2.403.30 1.653.30 1.653.30 1.653.30 2.403.60 2.403.60 4.505.50 Operate point (mT) +/-3.7 +/-3.0 +/-3.0 +/-3.0 +/-3.7 +/-3.7 +/-3.4 Hysteresis (mT) 0.8 0.9 0.9 0.9 0.8 0.8 0.4 Period (ms) 50 50 50 50 50 50 Supply current (AVG) (A) 8.0 5.0 5.0 5.0 8.0 8.0 2.0m Output type CMOS CMOS CMOS CMOS CMOS CMOS CMOS Package VCSP50L1 VCSP50L1 SSON004X1216 HVSOF5 HVSOF5 SSOP5 SSOP5
Plus is expressed on the S-pole; minus on the N-pole
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1/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Absolute Maximum Ratings BU52001GUL (Ta=25) PARAMETERS Power Supply Voltage Output Current Power Dissipation Operating Temperature Range Storage Temperature Range
Technical Note
SYMBOL VDD IOUT Pd Topr Tstg
LIMIT -0.1+4.51 1 420
2
UNIT V mA mW
-40+85 -40+125
1. Not to exceed Pd 2. Reduced by 4.20mW for each increase in Ta of 1 over 25 (mounted on 50mmx58mm Glass-epoxy PCB)
BU52015GUL (Ta=25) PARAMETERS Power Supply Voltage Output Current Power Dissipation Operating Temperature Range Storage Temperature Range
SYMBOL VDD IOUT Pd Topr Tstg
LIMIT -0.1+4.53 0.5 420
4
UNIT V mA mW
-40+85 -40+125
3. Not to exceed Pd 4. Reduced by 4.20mW for each increase in Ta of 1 over 25 (mounted on 50mmx58mm Glass-epoxy PCB)
BU52051NVX (Ta=25) PARAMETERS Power Supply Voltage Output Current Power Dissipation Operating Temperature Range Storage Temperature Range
SYMBOL VDD IOUT Pd Topr Tstg
LIMIT -0.1+4.55 0.5 20496 -40+85 -40+125
UNIT V mA mW
5. Not to exceed Pd 6. Reduced by 20.49mW for each increase in Ta of 1 over 25 (mounted on 70mmx70 mmx1.6mm Glass-epoxy PCB)
BU52011HFV (Ta=25) PARAMETERS Power Supply Voltage Output Current Power Dissipation Operating Temperature Range Storage Temperature Range
SYMBOL VDD IOUT Pd Topr Tstg
LIMIT -0.1+4.5 0.5 5368 -40+85 -40+125
7
UNIT V mA mW
7. Not to exceed Pd 8. Reduced by 5.36mW for each increase in Ta of 1 over 25 (mounted on 70mmx70 mmx1.6mm Glass-epoxy PCB)
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2/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G BU52021NVX (Ta=25) PARAMETERS Power Supply Voltage Output Current Power Dissipation Operating Temperature Range Storage Temperature Range
Technical Note
SYMBOL VDD IOUT Pd Topr Tstg
LIMIT -0.1+4.5 1 53610 -40+85 -40+125
9
UNIT V mA mW
9. Not to exceed Pd 10. Reduced by5.36mW for each increase in Ta of 1 over 25 (mounted on 70mmx70 mmx1.6mm Glass-epoxy PCB)
BU52025G (Ta=25) PARAMETERS Power Supply Voltage Output Current Power Dissipation Operating Temperature Range Storage Temperature Range
SYMBOL VDD IOUT Pd Topr Tstg
LIMIT -0.1+4.5 1 54012 -40+85 -40+125
11
UNIT V mA mW
11. Not to exceed Pd 12. Reduced by 5.40mW for each increase in Ta of 1 over 25 (mounted on 70mmx70 mmx1.6mm Glass-epoxy PCB)
BD7411G (Ta=25) PARAMETERS Power Supply Voltage Output Current Power Dissipation Operating Temperature Range Storage Temperature Range
SYMBOL VDD IOUT Pd Topr Tstg
LIMIT -0.3+7.0 1 54014 -40+85 -55+150
13
UNIT V mA mW
13. Not to exceed Pd 14. Reduced by 5.40mW for each increase in Ta of 1 over 25 (mounted on 70mmx70 mmx1.6mm Glass-epoxy PCB)
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3/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Magnetic, Electrical Characteristics BU52001GUL (Unless otherwise specified, VDD3.0V, Ta25) LIMIT PARAMETERS SYMBOL MIN TYP Power Supply Voltage Operate Point Release Point Hysteresis Period Output High Voltage Output Low Voltage Supply Current Supply Current During Startup Time Supply CurrentDuring Standby Time VDD BopS BopN BrpS BrpN BhysS BhysN Tp VOH VOL IDD(AVG) IDD (EN) IDD (DIS) 2.4 -5.5 0.8 VDD -0.4 3.0 3.7 -3.7 2.9 -2.9 0.8 0.8 50 8 4.7 3.8
Technical Note
MAX 3.3 5.5 -0.8 100 0.4 12 -
UNIT V mT mT mT ms V V A mA A
CONDITIONS
BrpN15
15
During Startup Time Value During Standby Time Value
15 B = Magnetic flux density 1mT=10Gauss Positive ("+") polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed.
BU52015GUL (Unless otherwise specified, VDD1.80V, Ta25) LIMIT PARAMETERS SYMBOL MIN TYP Power Supply Voltage Operate Point Release Point Hysteresis Period Output High Voltage Output Low Voltage Supply Current 1 Supply Current During Startup Time 1 Supply CurrentDuring Standby Time 1 Supply Current 2 Supply Current During Startup Time 2 Supply CurrentDuring Standby Time 2 VDD BopS BopN BrpS BrpN BhysS BhysN Tp VOH VOL IDD1(AVG) IDD1(EN) IDD1(DIS) IDD2(AVG) IDD2(EN) IDD2(DIS) 1.65 -5.0 0.6 VDD -0.2 1.80 3.0 -3.0 2.1 -2.1 0.9 0.9 50 5 2.8 1.8 8 4.5 4.0
MAX 3.30 5.0 -0.6 100 0.2 8 12 -
UNIT V mT mT mT ms V V A mA A A mA A
CONDITIONS
OUT1: BrpN16
16
16 B = Magnetic flux density 1mT=10Gauss Positive ("+") polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed.
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4/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G BU52051NVX , BU52011HFV (Unless otherwise specified, VDD1.80V, Ta25) BU52021HFV,BU52025G (Unless otherwise specified, VDD3.0V, Ta25) LIMIT PARAMETERS SYMBOL UNIT MIN TYP MAX Power Supply Voltage Operate Point Release Point Hysteresis Period Output High Voltage Output Low Voltage Supply Current Supply Current During Startup Time Supply CurrentDuring Standby Time VDD BopS BopN BrpS BrpN BhysS BhysN Tp VOH VOL IDD(AVG) IDD (EN) IDD (DIS) 2.4 -5.5 0.8 VDD -0.4 3.0 3.7 -3.7 2.9 -2.9 0.8 0.8 50 8 4.7 3.8 3.6 5.5 -0.8 100 0.4 12 V mT mT mT ms V V A mA A
Technical Note
CONDITIONS
BrpN17
17
During Startup Time Value During Standby Time Value
17 B = Magnetic flux density 1mT=10Gauss Positive ("+") polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. After applying power supply, it takes one cycle of period (TP) to become definite output. Radiation hardiness is not designed.
BD7411G (Unless otherwise specified, VDD5.0V, Ta25) LIMIT PARAMETERS SYMBOL MIN TYP Power Supply Voltage Operate Point Release Point Hysteresis Output High Voltage Output Low Voltage Supply Current VDD BopS BopN BrpS BrpN BhysS BhysN VOH VOL IDD 4.5 -5.6 1.5 4.6 5.0 3.4 -3.4 3.0 -3.0 0.4 0.4 2
MAX 5.5 5.6 -1.5 0.4 4
UNIT V mT mT mT V V mA
CONDITIONS
BrpN18
18
18 B = Magnetic flux density 1mT=10Gauss Positive ("+") polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor. Radiation hardiness is not designed.
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5/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Figure of measurement circuit
Technical Note
Bop/Brp
Tp
200
VDD VDD 100F GND OUT V
VDD VDD Oscilloscope GND OUT
Bop and Brp are measured with applying the magnetic field from the outside.
The period is monitored by Oscilloscope.
Fig.1
Bop,Brp measurement circuit
Fig.2
Tp measurement circuit
VOH
VDD VDD 100F GND OUT V IOUT
Product Name BU52001GUL, BU52021HFV, BU52025G, BD7411G BU52015GUL, BU52051NVX, BU52011HFV
IOUT 1.0mA 0.5mA
Fig.3
VOH measurement circuit
VOL
VDD VDD 100F GND OUT V IOUT
Product Name BU52001GUL, BU52021HFV, BU52025G, BD7411G BU52015GUL, BU52051NVX, BU52011HFV
IOUT 1.0mA 0.5mA
Fig.4
VOL measurement circuit
IDD
A VDD VDD C GND OUT
Product Name BU52001GUL,BU52015GUL,BU52051NVX, BU52011HFV, BU52021HFV, BU52025G BD7411G
C 2200F 100F
Fig.5
IDD measurement circuit
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6/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Technical (Reference) Data BU52001GUL (VDD=2.4V3.3V type)
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
Technical Note
8.0 6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0 -60 -40 -20 0 20 40 60 80 100 Bop N Brp N VDD=3.0V Bop S Brp S
8.0 6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0 2.0 2.4 2.8 3.2 3.6 SUPPLY VOLTAGE V
100
Ta = 25C
Bop S
PERIOD [ms]
90 80 70 60 50 40 30 20 10 0
VDD=3.0V
Brp S Brp N
Bop N
-60 -40 -20 0
20 40 60 80 100
AMBIENT TEMPERATURE []
AMBIENT TEMPERATURE []
Fig.6 Bop,Brp- Ambient temperature
100 90 80 PERIOD [ms] 70 60 50 40 30 20 10 0 2.0 2.4 2.8 3.2 SUPPLY VOLTAGE [V] 3.6
Fig.7 Bop,Brp- Supply voltage
Fig.8 TP- Ambient temperature
14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 2.0 2.4 2.8 3.2 SUPPLY VOLTAGE [V] 3.6
AVERAGE SUPPLY CURRENT [A]
Ta =
12.0 10.0 8.0 6.0 4.0 2.0 0.0
-60 -40 -20 0 20 40 60 80 100
AVERAGE SUPPLY CURRENT [A]
14.0
VDD=3.0V
Ta = 25C
Fig.9 TP- Supply voltage
AMBIENT TEMPERATURE []
Fig.10 IDD- Ambient temperature
Fig.11 IDD - Supply voltage
BU52015GUL, BU52051NVX, BU52011HFV (VDD=1.65V3.3V type)
8.0
MAGNETIC FLUX DENSITY [mT] 8.0
MAGNETIC FLUX DENSITY [mT]
100
Ta = 25C
6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0
VDD=1.8V
Bop S
6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0 1.4
90
Bop S
PERIOD [ms]
80 70 60 50 40 30 20 10 0
VDD=1.8V
Brp S Brp N
Brp S Brp N Bop N
Bop N
-60 -40 -20 0
20 40 60 80 100
1.8
2.2
2.6
3.0
3.4
3.8
-60 -40 -20 0
20 40 60 80 100
AMBIENT TEMPERATURE []
SUPPLY VOLTAGE V
AMBIENT TEMPERATURE []
Fig.12 Bop,Brp- Ambient temperature
Fig.13 Bop,Brp- Supply voltage
Fig.14 TP - Ambient temperature
AVERAGE SUPPLY CURRENT [A]
90 80 PERIOD [ms] 70 60 50 40 30 20 10 0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 SUPPLY VOLTAGE [V]
AVERAGE SUPPLY CURRENT [A]
100
14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0
-60 -40 -20 0 20 40 60 80 100
14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8 SUPPLY VOLTAGE [V]
Ta = 25C
VDD=1.8V
Ta = 25C
AMBIENT TEMPERATURE []
Fig.15 TP- Supply voltage
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Fig.16 IDD- Ambient temperature 7/19
Fig.17 IDD - Supply voltage
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G BU52021HFV, BU52025G (VDD=2.4V3.6V type)
AVERAGE SUPPLY CURRENT [A]
Technical Note
MAGNETIC FLUX DENSITY [mT]
8.0
MAGNETIC FLUX DENSITY [mT]
8.0
100 90 80 70 60 50 40 30 20 10 0 -60 -40 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE []
6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0
VDD=3.0V
Bop S
6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0 2.0
Ta = 25C
Bop S
VDD=3.0V
Brp S Brp N
Brp S Brp N
Bop N
Bop N
-60 -40 -20 0
20 40 60 80 100
2.4
2.8
3.2
3.6
4.0
AMBIENT TEMPERATURE []
SUPPLY VOLTAGE V
Fig.18 Bop,Brp- Ambient temperature
Fig.19 Bop,Brp- Supply voltage
Fig.20 TP - Ambient temperature
AVERAGE SUPPLY CURRENT [A]
AVERAGE SUPPLY CURRENT [A]
100 90 80 70 60 50 40 30 20 10 0 2.0
14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0
-60 -40 -20 0 20 40 60 80 100
14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 2.0 2.4 2.8 3.2 3.6 4.0 SUPPLY VOLATAGE [V]
Ta = 25C
VDD=3.0V
Ta = 25C
PERIOD [ms]
2.4
2.8
3.2
3.6
4.0
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE []
Fig.21 TP - Supply voltage
Fig.22 IDD - Ambient temperature
Fig.23 IDD - Supply voltage
BD7411G (VDD=4.5V5.5V type)
6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0 -60 -40 -20 0 20 40 60 80 100
Bop N Brp N
6.0 4.0 2.0 0.0 -2.0 -4.0 -6.0 -8.0 4.0 4.5 5.0 5.5 6.0 SUPPLY VOLTAGE V Brp N Bop N
VDD=5.0V
Bop S
AVERAGE SUPPLY CURRENT [mA]
MAGNETIC FLUX DENSITY [mT]
8.0
MAGNETIC FLUX DENSITY [mT]
8.0 Ta = 25C Bop S Brp S
6.0 5.0 4.0 3.0 2.0 1.0 0.0
-60 -40 -20 0 20 40 60 80 100
VDD=5.0V
Brp S
AMBIENT TEMPERATURE []
AMBIENT TEMPERATURE []
Fig.24 Bop,Brp- Ambient temperature
AVERAGE SUPPLY CURRENT [mA] 6.0 5.0 4.0 3.0 2.0 1.0 0.0 4.0 4.5 5.0 5.5 6.0 SUPPLY VOLTAGE [V]
Fig.25
Bop,Brp- Supply voltage
Fig.26 IDD - Ambient temperature
Ta = 25C
Fig.27 IDD - Supply voltage
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8/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Block Diagram BU52001GUL
DD
A1
Technical Note
0.1F Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc.
TIMING LOGIC HALL ELEMENT DYNAMIC OFFSET CANCELLATION SAMPLE & HOLD LATCH
The CMOS output terminals enable direct
B1
x
OUT connection to the PC, with no external pull-up resistor required.
A2
GND
Fig.28 A2 A1
PIN No. A1 A2 B1 B2
PIN NAME VDD GND OUT N.C.
FUNCTION POWER SUPPLY GROUND OUTPUT
COMMENT
A1
A2
OPEN or Short to GND.
B1
B2
B2
B1
Surface
Reverse
BU52015GUL
VDD
B2
0.1F Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc.
TIMING LOGIC DYNAMIC OFFSET CANCELLATION HALL ELEMENT x
A1
OUT1
SAMPLE & HOLD
LATCH
GND VDD
A2
The CMOS output terminals enable direct connection to the PC, with no external pull-up resistor required. OUT2
B1
GND
Fig.29 PIN No. A1 A2 B1 B2 PIN NAME OUT1 OUT2 GND VDD FUNCTION Output pin (Active Low) Output pin (Active High) GROUND Power Supply Voltage B1 B2 B2 B1 COMMENT A1 A2 A2 A1
Surface
Reverse
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9/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G BU52051NVX
DD
4
Technical Note
0.1F Adjust the bypass capacitor value as necessary, according to
TIMING LOGIC HALL ELEMENT DYNAMIC OFFSET CANCELLATION
voltage noise conditions, etc. The CMOS output terminals enable direct SAMPLE & HOLD LATCH
1
x
OUT
connection to the PC, with no external pull-up resistor required.
2
GND
Fig.30 4 PIN No. 1 2 3 4 PIN NAME OUT GND N.C. VDD POWER SUPPLY FUNCTION OUTPUT GROUND OPEN or Short to GND. 1 2 Surface 2 1 Reverse COMMENT 3 3 4
BU52011HFV,BU52021HFV
DD
4
0.1F Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc.
TIMING LOGIC HALL DYNAMIC OFFSET CANCELLATION ELEMENT
The CMOS output terminals enable SAMPLE & HOLD LATCH
5
x
OUT
direct connection to the PC, with no external pull-up resistor required.
2
GND
Fig.31
PIN No. 1 2 3 4 5
PIN NAME N.C. GND N.C. VDD OUT
FUNCTION
COMMENT OPEN or Short to GND.
5
4
4
5
GROUND OPEN or Short to GND. POWER SUPPLY OUTPUT 1 2 3 Surface 3 2 1
Reverse
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10/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G BU52025G
DD
4
Technical Note
0.1F Adjust the bypass capacitor value as necessary, according to voltage noise conditions, etc. The CMOS output terminals enable direct
TIMING LOGIC DYNAMIC OFFSET CANCELLATION HALL ELEMENT
SAMPLE & HOLD
x
LATCH
5
OUT
connection to the PC, with no external pull-up resistor required.
2
GND
Fig.32 PIN No. 1 2 3 4 5 BD7411G
DD
5
PIN NAME N.C. GND N.C. VDD OUT
FUNCTION
COMMENT OPEN or Short to GND. 5 4 4 5
GROUND OPEN or Short to GND. POWER SUPPLY OUTPUT 1 2 3 Surface 3 2 1 Reverse
0.1F Adjust the bypass capacitor value as necessary, according to voltage
REG HALL ELEMENT
TIMING LOGIC
noise conditions, etc.
The CMOS output terminals enable direct DYNAMIC OFFSET CANCELLATION connection to the PC, with no external pull-up SAMPLE & HOLD LATCH resistor required.
4
x
OUT
2
GND
Fig.33 PIN No. 1 2 3 4 5 PIN NAME N.C. GND N.C. OUT VDD OUTPUT POWER SUPPLY 1 2 3 Surface 3 2 1 Reverse GROUND OPEN or Short to GND. FUNCTION COMMENT OPEN or Short to GND. 5 4 4 5
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11/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Description of Operations (Micropower Operation) IDD Period Startup time Standby
Technical Note
The Omnipolar detection Hall IC adopts an intermittent operation method to save energy. At startup, the Hall elements, amp, comparator and other detection circuits power ON and magnetic detection begins. During standby, the detection circuits power OFF, thereby reducing current consumption. The detection results are held while standby is active, and then output. Reference period: 50ms (MAX100ms) Reference startup time: 48s
BD7411G don't adopts an intermittent operation method.
t Fig.34
(Offset Cancelation) VDD I
Bx
Hall Voltage
GND Fig.35
The Hall elements form an equivalent Wheatstone (resistor) bridge circuit. Offset voltage may be generated by a differential in this bridge resistance, or can arise from changes in resistance due to package or bonding stress. A dynamic offset cancellation circuit is employed to cancel this offset voltage. When Hall elements are connected as shown in Fig. 35 and a magnetic field is applied perpendicular to the Hall elements, voltage is generated at the mid-point terminal of the bridge. This is known as Hall voltage. Dynamic cancellation switches the wiring (shown in the figure) to redirect the current flow to a 90 angle from its original path, and thereby cancels the Hall voltage. The magnetic signal (only) is maintained in the sample/hold circuit during the offset cancellation process and then released.
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12/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G (Magnetic Field Detection Mechanism)
Technical Note
S S S N S N
N
Flux
Flux
Fig.36 The Hall IC cannot detect magnetic fields that run horizontal to the package top layer. Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.
S S N
N N S
OUT [V] Flux Flux High High High
Low Bop N Brp N 0 Magnetic flux density [mT] Fig.37 Brp S Bop S
Low B
S-Pole
N-Pole
The Omnipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output mode, the distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.) This detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation.
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13/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Intermittent Operation at Power ON Power ON
Technical Note
VDD Startup time
Supply current (Intermittent action)
Standby time
Startup time
Standby time
OUT
(No magnetic field present)
Indefinite
High
OUT
(Magnetic field present)
Indefinite
Low
Fig.38 The Omnipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as shown in Fig. 38. It outputs to the appropriate terminal based on the detection result and maintains the output condition during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage.
BD7411G don't adopts an intermittent operation method.
Magnet Selection Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume than ferrite, thereby enabling the highest degree of miniaturization, Thus, neodymium is best suited for small equipment applications. Fig. 39 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet (1mm, 2mm, and 3mm thick) and magnetic flux density. Fig. 40 shows Hall IC detection distance - a good guide for determining the proper size and detection distance of the magnet. Based on the BU52011HFV, BU52015GUL operating point max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and 10.4mm, respectively. To increase the magnet's detection distance, either increase its thickness or sectional area. 10
9 Magnetic flux density[mT] 8 7 6 5 4 3 2 1 0 0 2 4 6
7.6mm
t=3mm t=1mm t=2mm
9.2mm 10.4mm
8
10
Fig.39
12
14
16
18
20
Distance between magnet and Hall IC [mm]
X Y
t X=Y=4mm t=1mm,2mm,3mm Magnet size
Magnet
Magnet material: NEOMAX-44H (material) Maker: NEOMAX CO.,LTD. t
L: Variable ...Flux density measuring point
Fig.40 Magnet Dimensions and Flux Density Measuring Point 14/19
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2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Position of the Hall Effect IC(Reference)
Technical Note
VCSP50L1 0.55 0.55
SSON004X1216 0.6 0.8 0.8
HVSOF5 0.6 1.45
SSOP5 0.8
0.35
0.2
0.2
0.6
(UNITmm) Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition) VCSP50L1 SSON004X1216
Please avoid having potential overstress from PCB material, strength, mounting positions. If you had any further questions or concerns, please contact your Rohm sales and affiliate.
HVSOF5
SSOP5
(UNITmm)
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15/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Terminal Equivalent Circuit Diagram OUT , OUT1, OUT2 VDD
Technical Note
Because they are configured for CMOS (inverter) output, the output pins require no external resistance and allow direct connection to the PC. This, in turn, enables reduction of the current that would otherwise flow to the external resistor during magnetic field detection, and supports overall low current (micropower) operation.
GND Fig.41 Operation Notes 1) Absolute maximum ratings Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in excess of absolute rating limits. 2) GND voltage Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower than the potential of all other pins. 3) Thermal design Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted together, or if shorts occur between the output pin and supply pin or GND. 5) Positioning components in proximity to the Hall IC and magnet Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design. 6) Slide-by position sensing Fig.42 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet and the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen in Fig.43, the magnetic field runs in opposite directions at Point A and Point B. Since the Omnipolar detection Hall IC can detect the S-pole at Point A and the N-pole at Point B, it can wind up switching output ON as the magnet slides by in the process of position detection. Fig. 44 plots magnetic flux density during the magnet slide-by. Although a reverse magnetic field was generated in the process, the magnetic flux density decreased compared with the center of the magnet. This demonstrates that slightly widening the gap (d) between the magnet and Hall IC reduces the reverse magnetic field and prevents malfunctions.
Magnet Slide
Flux
Magnetic fux density[mT]
d Hall IC L Fig.42
A S N
Fig.43
B
Flux
10 8 6 4 2 0 -2 -4 -6 -8 -10 0 1 2 3 4 5
Reverse
6
7
8
9
10
Horizontal distance from the magnet [mm]
Fig.44
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16/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
7) Operation in strong electromagnetic fields Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause the IC to malfunction. 8) Common impedance Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example, employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or capacitor. 9) GND wiring pattern When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components. 10) Exposure to strong light Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and fluorescent light sources was shown to have no significant effect on the IC. 11) Power source design Since the IC performs intermittent operation, it has peak current when it's ON. Please taking that into account and under examine adequate evaluations when designing the power source.
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17/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G Ordering part number
Technical Note
B
Part No.
D
7
4
1
1
G
-
T
R
Part No. 52001,52015 52025,7411 52051 52011,52021
Package GUL: VSCP50L1 G: SSOP5 NVX: SSON004X1216 HFV: HVSOF5
Packaging and forming specification E2: Embossed tape and reel (VSCP50L1 ) TR: Embossed tape and reel (SSOP5, HVSOF5, SSON004X1216)
VCSP50L1 (BU52001GUL,BU52015GUL)

Tape Quantity Direction of feed Embossed carrier tape 3000pcs E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
(Unit:mm)
1pin Reel
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
SSOP5
2.90.2
5 4
+6 4 -4

Tape Quantity Direction of feed Embossed carrier tape 3000pcs TR
The direction is the 1pin of product is at the upper right when you hold
+0.2 1.6 -0.1
2.80.2
1
2
3
0.2Min.
( reel on the left hand and you pull out the tape on the right hand
1pin
)
+0.05 0.13 -0.03
1.25Max.
1.10.05
0.050.05
+0.05 0.42 -0.04 0.95 0.1
Direction of feed
(Unit : mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
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18/19
2010.01 - Rev.C
BU52001GUL,BU52011HFV,BU52021HFV, BU52015GUL,BU52025G,BU52051NVX, BD7411G
Technical Note
SSON004X1216
1.20.1
1.6 0.1

Tape Quantity Direction of feed
S
+0.03 0.02 -0.02 (0.12)
Embossed carrier tape 5000pcs TR
The direction is the 1pin of product is at the upper right when you hold
1PIN MARK
0.6MAX
( reel on the left hand and you pull out the tape on the right hand
)
0.08 S +0.05 0.2 -0.04
0.2 0.1
0.650.1
1 2
4
3
0.8 0.1
0.750.1
1pin
Direction of feed
(Unit : mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
HVSOF5

1.60.05 (0.8)
0.2MAX
Tape Quantity Direction of feed
Embossed carrier tape 3000pcs TR
The direction is the 1pin of product is at the upper right when you hold
1.20.05 (MAX 1.28 include BURR)
1.00.05
(0.05)
(0.3)
1.60.05
5
4
4
5
(0.91)
(0.41)
( reel on the left hand and you pull out the tape on the right hand
1pin
)
123
321
0.130.05 S
0.6MAX
+0.03 0.02 -0.02
0.1 0.5 0.220.05
S 0.08
M
Direction of feed
(Unit : mm)
Reel
Order quantity needs to be multiple of the minimum quantity.
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19/19
2010.01 - Rev.C
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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